The manufacture method of the combination equipment of the earphone pin and core wire

　　In the headphone manufacturing industry, the headphone core wires should be welded separately on each welding pad that the earphone pin and its function match. The traditional way is to transfer the tin wire melting by hand to each welding pad of the earphone pin and heat the pre tin, then close the earphone core wire to the top of the tinned earphone pin pad, and use the soldering iron to heat the tin wire to the melting state, and weld the earphone core wire and each welding pad of the earphone pin together. But the process is more complex, so it is necessary to weld each pad of the earphone pin and the individual core wire one by one, which will take more time, and the welding difficulty is also relatively large and the working efficiency is low. Because of the difference of the operator's skill level, many appearance defects are caused during welding. After the completion, the solder joint has a large difference, and the welding defect rate is high, which has a direct impact on the quality and service life of the headset.

　　A combination device of headphone pin and core wire is provided to reduce the welding difficulty of headphone pin and core wire, and enhance the production efficiency of headphones. To solve the above mentioned problems, the combination equipment of headphone pin and core wire includes wiring tooling and welding device. The said wiring tool includes the base plate for installing the earphone pin, the core line positioning block fixed on the base plate for fixing the conductor, and the core positioning block has groove for restraining the wire. One side of the core positioning block is provided with a core applied to the solder dip at the extended end The grid hole of the wire, the gate hole and the groove are connected. The base plate is provided with an independent opening applied to the solder part exposed to each core wire, and the independent opening corresponds to the welding pad of the headphone pin.

　　As an improvement, the device on the base plate has some earphone pins arranged in series. The number of core positioning blocks is the same as the number of headphone pins. The base plate is equipped with independent openings as the sum of all cores. The base plate is fixed with a positioning block for the earphone pin, and the headphone pin positioning block is provided with a positioning hole for the headphone pin, and the headphone pin is inserted in the positioning hole of the earphone pin. The upstream position of the welding device is equipped with a flux spray device for spraying flux treatment on the solder part of the core wire and the welding pad of the corresponding earphone pin. A flux preheating device is arranged between the spray flux device and the welding device.

　　Because of the design of the base plate and core line positioning block, the gate holes are designed on the side of the core positioning block, which makes the core wire separated by the grid hole slowly and extend the core line positioning block, so as to prevent adhesion in the future welding.

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