Connector classification and its future development trend

　　With the rapid development of communication networks, China's connector market development prospects are very optimistic. Global electronic manufacturing service providers (EMS) are also migrating to the Chinese market, and China is gradually becoming the global electronics manufacturing center.

　　The types of connectors are classified according to shape and process technology, and there are future development trends:

　　First: circular connector

　　The military circular connectors of developed countries have mature manufacturing technology, high engineering degree, and high technological content (or attributes), which are mainly manifested in four aspects: the selection of lightweight, fast and durable composite materials and surface treatment technology; ultra-small Realization of aerospace-level engineering; rich varieties of derivatives (far more than domestic models), such as quad coaxial and optical fiber products suitable for high-speed networks, USB and RJ45 products for Ethernet networks, drop-out -Push-pull-pull wire cabinet type products, airtight and potting products, filtering products, cabin-through products, etc.

　　The second type: high voltage connector

　　High-voltage connectors refer to connectors that work above 1KV. The application fields are concentrated in avionics, X-ray devices, helmet-mounted displays for pilots, and helmet-mounted sighting devices.

　　Domestic high-voltage connectors have only started in recent years, but major breakthroughs have been made, and they are now achieving a model spectrum, and the situation of relying on imports is slowly breaking. The current problem is that the manufacturing of high-voltage resistant materials, high-voltage performance testing, and related processing links are still difficult to completely overcome. There is still a long way to go to establish a mature manufacturing system and mass supply.

　　Third: MEMS connector

　　Traditionally, connector manufacturers have relied on metal cutting and extrusion processes to process pins. With the deepening of equipment and component miniaturization, traditional processing methods have gradually restricted the miniaturization of pins. The use of MEMS (Micro-Electro-Mechanical System) technology enables mass-production of connectors with micron-level pitches, which brings new hope to the future to increase the density of connectors and solve the requirements for miniaturization. The standard MEMS manufacturing process (batch microcomputer addition and electroplating) is selected and manufactured on a silicon substrate. Up to now, MEMS connectors are only limited to the concept stage, because the lateral (horizontal) deformation of the pins will affect the optimization of performance.

　　Fourth: optical fiber connector

　　Research shows that when the data transmission exceeds 10Gb/s, the copper-based system will be increasingly restricted at the technical level. Compared with copper-based systems and coaxial transmission systems, the biggest advantages of optical fiber transmission are: higher bandwidth, faster transmission speed, lighter weight, EMI/RFI resistance and cheaper materials.

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