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5G radio frequency pogo pin design level and processing methods

time:2021-03-03 Views:276

  In order to adapt to new demands, 5G radio frequency pogopin products are developing towards small size, narrow pitch, and multi-function. In addition, surface mounting, composite and embedded development are also a future development direction. The volume and external dimensions of the connector are becoming more and more miniaturized and chip-shaped. The miniaturization of electronic products also requires miniaturization or even more miniaturization for its matching connectors. For example, portable handheld digital products such as mobile phones that require high connector miniaturization. The number of contacts and contact specifications of traditional connectors are usually unchangeable. If users need to change the number of contacts and specifications of contacts, they must switch to other connectors, and the emergence of modular connector technology , To further solve this problem.

5G radio frequency pogo pin design level and processing methods(图1)

  The rapid development of the market has promoted the acceleration of the technological innovation of the connector, and the design level and processing methods of the connector have also been greatly improved. Industry experts said that semiconductor chip technology is gradually becoming the technological driving force for the development of connectors at all levels of interconnection. For example, with the rapid development of 0.5mm pitch chip packaging towards 0.25mm pitch, level I interconnection (inside IC devices) and The number of device pins for level II interconnection (device-board interconnection) ranges from hundreds to thousands of lines.

  In recent years, fiber optic connectors, USB2.0 high-speed connectors, wired broadband connectors, and fine-pitch connectors have been increasingly used in various portable/wireless electronic devices, and even the higher-speed USB3.0 has gradually increased. Appeared on the market. Therefore, the market application hot spots of connectors are also changing. The electronic process of global enterprises and markets is also becoming faster and faster. Under the financial crisis environment, the Chinese government has invested heavily in three networks, smart grids, automobiles, and rail transit. It can be seen that the market has The requirements for high-speed interconnection and current resistance are also getting higher and higher. From the perspective of consumer electronics, applications similar to Internet TV are hot, and they are related to the application of many antennas. TV system manufacturers require antennas to be installed within a small distance.


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