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Analysis of problems in PogoPin connector electroplating

source:spring thimble release time:2021-08-18 Article author:sznbone Popular:POGO PIN

  In pogopin connector electroplating, due to the higher electrical performance requirements of the contact, the gold plating process occupies an obvious important position in the pogopin connector electroplating. At present, except for the selective electroplating process of some pogopin connectors with material, the rest A large number of pinhole parts are still plated by barrel plating and vibration plating. In recent years, the volume of connectors has become more and more miniaturized, and the quality problem of gold plating in the holes of pinhole parts has become increasingly prominent. The quality requirements for the gold layer are getting higher and higher, and some users are even very picky about the appearance quality of the gold layer. In order to ensure the quality of the gold layer of the connector, the bonding strength of these types of common quality problems always improve the gold plating quality of the connector The key. The reasons for these quality problems will be discussed one by one.

Spring probe M001 1.5x4.6

  1. The color of the gold layer is abnormal

  The color of the pogopin connector gold plating layer is inconsistent with the normal gold layer color, or the gold layer color of different parts in the same supporting product is different. The reasons for this problem are:

  2. Impact of gold-plated raw material impurities

  When the impurity introduced by the chemical material added to the plating solution exceeds the tolerance of the gold plating solution, it will quickly affect the color and brightness of the gold layer. If it is affected by organic impurities, the gold layer will become dark and bloom. The location of the chip inspection is not fixed. If the interference of metal impurities, the effective range of current density will be narrowed. The Haul tank test shows that the current density of the test piece is not bright at the low end or the high end is not bright and the low end is not plated. Reflected on the plated parts, the coating is reddish or even black, and the color changes in the holes are more obvious.

  3. The gold plating current density is too large

  Due to the calculation error of the total area of the plating tank parts, the value is greater than the actual surface area, so that the gold plating current is too large, or the amplitude is too small when vibrating gold electroplating, so that all or part of the gold plating in the tank is crystallized rough, and the gold is visually observed. Redness of the layers.


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