In recent years, surface mount technology has developed rapidly and has a pivotal position in the electronics industry. In addition to the scale effect of fully automated production, SMT has the following technical advantages: components can be mounted on both sides of the PCB to achieve high-density assembly; even the smallest size components can achieve precision mounting.
The convenience of operation and the mechanical strength of the pin header are also very important factors. The connector is usually the communication interface between the PCB motherboard and external components, so it may sometimes encounter considerable external forces.
Through-hole technology assembly components are much higher in reliability than the corresponding SMT components. No matter it is compact and easy to mount, there is a clear difference in size and assembly form from the through-hole pin header.
The processing of pin headers and round holes for field wiring in the industrial field is usually a high-power component that is strongly pulled, squeezed or thermally shocked, and it can withstand it, and it is not easy to leave the PCB.
In some cases, these advantages diminish as the adhesion force of the components on the PCB decreases. The characteristic of SMT components is design. It can meet the needs of transmitting high voltage and large current. Therefore, sufficient electrical clearance and creepage distance must be considered when designing. These factors ultimately affect the size of the component.