The pogo pin material

　　The pogo pin material is mainly made of copper and requires surface treatment to make it have corrosion resistance, friction resistance and other properties. Typical surface treatment is gold plating after nickel plating and tin plating after copper plating. Now we will simply analyze the surface treatment process of connectors such as electroplating process, equipment, products to be plated and electroplating layer. The pogo pin electroplating process is the same as the general electroplating process, but the operation time of each process is significantly shorter than that of the general electroplating process. Therefore, each treatment solution and plating solution must be adjusted accordingly to meet the requirements of short operation time. Now let's follow Jingcheng Industrial to learn about the gold plating process of the pogo pin.

　　First, degreasing: unlike the general electroplating process, the degreasing time of pogo pin is 2-5 seconds, so multi-stage electrolytic degreasing under high current density is required.

　　Second, pickling: due to the size requirements of the metal to be plated, the pogo pin usually adopts chemical grinding or electrochemical grinding instead of metal self dissolution.

　　Third, nickel plating: sulfamate bath is usually used for pogo pin. The purpose of nickel plating is to provide a base coating for gold and tin plating to improve corrosion resistance, and to prevent the mutual diffusion between the base material (mostly copper alloy) and the gold layer, or with the lead layer, resulting in the degradation of the performance of the electrodeposited coating.

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